BEACON Invites you for a Live Seminar to know how “Electronic Thermal and High Frequency challenges” has taken a quantum leap transformation for incorporating increased power density and various wireless communication devices within a very much optimized size range.
Over the last two decades, “Electronic Thermal and High Frequency challenges” has taken a quantum leap transformation for incorporating increased power density and various wireless communication devices within a very much optimized size range.
This session focuses on how the above challenges are addressed virtually using analysis software to map the applications like “un-interrupted data transfer”, “GPS Navigation System”, “Bluetooth enablement”, and “EMI/EMC” compliance.
We hope this session will be a kick start to look into the new methodologies adopted to mitigate forthcoming power electronics/thermal issues for futuristic Hi -Tech devices.